Wiley-IEEE Press Publishes iNEMI Lead-Free Book
November 21, 2007 // Published as a news service by IHS
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The International Electronics Manufacturing Initiative (iNEMI) published Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing.
The book, published by Wiley-Institute of Electrical and Electronics Engineers (IEEE) Press, is based on the results of iNEMI's more than six-year study into lead (Pb)-free electronics and it provides coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly.
The movement to lead-free electronic assembly was challenging to the electronics industry, according to iNEMI.
For more than 50 years, eutectic tin-lead (SnPb) solder was studied, categorized and optimized for electronics manufacturing applications.
In a few years, Pb-free solder assembly had to be put into wide-scale production and it disrupted the status quo, said iNEMI. Much of the work to rally the electronics industry to prepare for Pb-free assembly is described in this book.
"The iNEMI book is the first practical, primary reference to cover lead-free solder assembly as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder," said Jim McElroy, iNEMI CEO.
"Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder."
Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing features chapters on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework and tin whisker mitigation strategies.
Source: International Electronics Manufacturing Initiative (iNEMI).