Electro/Telecom Industry Trends
June 2005
RoHS and WEEE Related Standards and Publications
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Global Engineering Documents, the retail arm of IHS, is your single source for individual standards and publications or integrated collections via hardcopy or electronic delivery. Accessing critical technical information is faster than ever! The following are just some of our many products and services that pertain specifically to RoHS and WEEE standards & specifications. To order any of these documents online, click the document title to order from our webstore, global.ihs.com. For information on our many other products and services go to global.ihs.com or contact us directly at 877-413-5187 (Si Hablamos Español), 303-397-7956 or 800-874-4476 (Mexico only) and mention PRIORITY CODE W029. Customers outside the U.S. should contact your local IHS Global Info Centre; see Access Global Worldwide for a listing.
40 CFR 81-85
Protection of Environment
40 CFR 260-265
Protection of Environment
40 CFR 266-299
Protection of Environment
40 CFR 700-789
Protection of Environment
BS EN 1122
Plastics - Determination of Cadmium - Wet Decomposition Method
BS EN 50419
Marking of Electrical and Electronic Equipment in Accordance with Article 11(2) of Directive 2002/96/EC (WEEE)
BS EN ISO 3613
Chromate Conversion Coating on Zinc, Cadmium - Aluminum – Zinc Alloys and Zinc - Aluminum Alloys - Test Methods
EEC/2000/53
European Parliament and of the Council on End-of Life Vehicles
EEC/2002/95
Directive of the European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronic Equipment
EEC/2002/96
Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE)
EIA/ECCB-952
Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment
EIA/ECCB-954
Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements
IPC-A-610
Acceptability of Electronic Assemblies
IPC-1065
Material Declaration Handbook (For Users and Manufacturers of Printed Circuit Boards)
IPC-1066
Marking, Symbols and Labels for Identification of Lead-Free and other Reportable Materials in Lead-Free Assemblies, Components and Devices
IPC-ELEC-04
Lead-Free Electronics 2004 Edition
IPC-ELEC-ENVIRO
Environment-Friendly Electronics; Lead-Free Technology
IPC-ELEC-LEAD
Electronics Manufacturing with Lead-Free, Halogen-Free and Conductive Adhesive Materials
ISO 1043-1
Plastics - Symbols and Abbreviated Terms – Part 1: Basic Polymers and their Special Characteristics
ISO 3856/5
Paints and Varnishes-Determination of "Soluble" ME
ISO/IEC 17050-1
Conformity Assessment - Supplier's Declaration of Conformity - Part 1: General Requirements
ISO 14001
Environmental Management Systems - Requirements with Guidance for Use
ISO TR 14062
Environmental Management - Integrating Environmental Aspects into Product Design and Development
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003
Solderability Test Methods for Printed Wiring Boards
J-STD-004
Requirements for Soldering Fluxes
J-STD-005
Requirements for Soldering Pastes
J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-033
Standard for Handling, Packing, Shipping and use of Moisture/Reflow Sensitive Surface Mount Devices
JEDEC JESD 97
Marking, Symbols, and Labels for Identification of Lead (PB) Free Assemblies, Components, and Devices
JEDEC JESD 22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
JIS Z 3198-1
Test Methods for Lead-Free Solders - Part 1: Methods for Measuring of Melting Temperature Ranges
JIS Z 3198-2
Test Methods for Lead-Free Solders - Part 2: Methods for Testing Mechanical Characteristics - Tensile Test
JIS Z 3198-3
Test Methods for Lead-Free Solders - Part 3: Methods for Spread Test
JIS Z 3198-4
Test Methods for Lead-Free Solders - Part 4: Methods for Solderability Test by a Wetting Balance Method and a Contact Angle Method
JIS Z 3198-5
Test Methods for Lead-Free Solders - Part 5: Methods for Tensile Tests and Shear Tests on Solder Joint
JIS Z 3198-6
Test Methods for Lead-Free Solders - Part 6: Methods for 45 Degree Pull Test of Solder Joints on QFP Lead
JIS Z 3198-7
Test Methods for Lead-Free Solders - Part 7: Methods for Shear Strength of Solder Joints on Chip Components